Temperature Control for an Information Handling System Rack

ABSTRACT

A system for controlling the temperature of a rack includes a connecting plenum configured to receive incoming cooling air from outside a rack for cooling the rack; a front plenum connected to the connecting plenum and configured to receive cooling air from the connecting plenum and deliver the cooling air to the rack, the cooling air being warmed by powered electrical components as it passes through the rack; at least one ventilator for recycling warmed cooling air from the rack back to the connecting plenum to be mixed with incoming cooling air; a sensor for sensing temperature of air in the rack; and a controller for controlling the at least one ventilator based at least on the sensed temperature.

TECHNICAL FIELD

The present disclosure relates in general to information handlingsystems, and more particularly to systems and methods for controllingthe temperature in an information handling system rack (e.g., a serverrack).

BACKGROUND

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

A group of one or more information handling systems may form aninformation handling center. An information handling center can occupyone room of a building, one floor, or an entire building, for example.An information handling center may include, for example, a number ofservers racked up into 19 inch rack cabinets, often placed in singlerows forming corridors between them, which allows human access to thefront and rear of each cabinet. Servers differ greatly in size from 1Uservers to very large storage silos. Some equipment such as mainframecomputers and storage devices are often as big as the racks themselves.

A 19-inch rack is a standardized system for mounting various electronicmodules in a “stack,” or rack that is 19 inches (482.6 mm) wide.Equipment designed to be placed in a rack is typically described asrack-mount, a rack mounted system, a rack mount chassis, subrack, rackmountable, or simply shelf. This standard rack arrangement is widelyused throughout the telecommunication, computing, audio, entertainmentand other industries.

The physical environment of an information handling center is typicallyunder strict control, especially the temperature within the informationhandling center. Air conditioning is typically used to control thetemperature and humidity in the information handling center. Forexample, a temperature range of 20-25° C. and humidity range of 40-60%is typically suitable for information handling center conditions. Theelectrical power used by the electronic equipment is converted to heat,which is transferred to the ambient air in the space near the electronicequipment. Unless the heat is removed, the ambient temperature willrise, which may result in electronic equipment malfunction. Bycontrolling the air temperature of the space, the electronic componentsmay be kept within the manufacturer's specified temperature/humidityrange. Air conditioning systems may help control space humidity withinacceptable parameters by cooling the return space air below the dewpoint. A raised floor may be used in order to distribute cooled airwithin an information handling center.

Information handling centers are typically equipped with a raised floorwith vent tiles configured to provide cool air to the informationhandling systems (e.g., racks) from a pressurized plenum in the spacebelow the raised floor. One system for cooling racks has been suggestedbefore in US Patent Publication No. 2005/0237716 A1, “Air Flow Systemand Method for Facilitating Cooling of Stacked Electronics Components”where an airflow plenum is added to either and/or the front and rear ofa rack. In the case where the plenum is added to the front of the rack,it picks up air from a tile supplying cool air immediately in front ofthe rack.

These vent tiles are typically unable to vary the airflow dynamically tothe information handling center. In addition, the vent tiles typicallyoperate without knowledge of how each vent tile affects informationhandling systems in its proximity. This may have unintendedconsequences, e.g., inadequate airflow delivery to the racks and/orwasted energy consumption, which may lead to inefficiencies in bothcooling of the information handling systems as well as in the operationsof air conditioning units.

It is desirable to distribute air having a controlled temperature toinformation handling systems, such as for example racks. This may avoidtoo high or too low ambient air temperatures of a rack. Reducing orminimizing chilled air consumption is beneficial, e.g., to loweroperating costs of an information handling center. In addition, reducingthe total flow of air in a raised floor and/or air conditioned room maylower running costs.

Reduce airflow consumption in rack products, especially servers, istypically desirable, as facility electricity devoted to cooling can besubstantial. In a typical chilled water facility, for example, wherelarge air handling units (AHU) pressurize a raised floor, energy is usedby the AHU to transport chilled air to the server and heated air backfrom the server. Energy is also used remotely at the chiller plant tochill water for use around the facility, at the outside condenser forultimate heat rejection, and for transporting fluid (generally water) toand from the chiller and condenser. As the AHU uses energy to move air,it also adds heat to the facility which must also be removed through thechiller and condenser. The open raised floor environment is oftenaccompanied by a large over-provisioning of AHU's due to poor andunpredictable airflow dynamics that create hot spots. Many data centersend up over-provisioning to cool these hot spots and/or spend much moreenergy than needed in chilling the air to temperatures lower thannecessary.

SUMMARY

In accordance with the teachings of the present disclosure, certaindisadvantages and problems associated with cooling of rack-mountedelectronic units have been substantially reduced or eliminated.

According to certain embodiments of the present disclosure, a system forcontrolling the temperature of a rack includes a connecting plenumconfigured to receive incoming cooling air from outside a rack forcooling the rack; a front plenum connected to the connecting plenum andconfigured to receive cooling air from the connecting plenum and deliverthe cooling air to the rack, the cooling air being warmed by poweredelectrical components as it passes through the rack; at least oneventilator for recycling warmed cooling air from the rack back to theconnecting plenum to be mixed with incoming cooling air; a sensor forsensing temperature of air in the rack; and a controller for controllingthe at least one ventilator based at least on the sensed temperature.

According to certain other embodiments of the present disclosure, asystem includes a rack, a plurality of information handling systemsdisposed in the rack, and a temperature control system for controllingthe temperature of the rack. The temperature control system includes aconnecting plenum configured to receive incoming cooling air fromoutside a rack for cooling the rack; a front plenum connected to theconnecting plenum and configured to receive cooling air from theconnecting plenum and deliver the cooling air to the rack, the coolingair being warmed by powered electrical components as it passes throughthe rack; a back plenum configured to received warmed cooling air fromthe rack; at least one controllable ventilator for recycling warmedcooling air from the back plenum to the connecting plenum to be mixedwith incoming cooling air; at least one temperature sensor for sensingair temperature in the system; and a controller for controlling the atleast one ventilator based at least on the sensed air temperature.

According to certain other embodiments of the present disclosure, amethod for controlling a cooling system configured to control thetemperature of an information handling system rack is provided. Themethod includes setting a target temperature or a target temperatureband for an information handling system rack and operating a coolingsystem. The cooling system is operated such that cooling air is receivedfrom outside the cooling system into a connection plenum, flows from theconnection plenum to a delivery plenum, and flows from the deliveryplenum through the information handling system rack, the cooling airbeing warmed by electrical components as the cooling air flows throughthe information handling system rack. The method further includes takingone or more air temperature measurements, and based on the one or moreair temperature measurements, controlling one or more ventilators tocontrol an amount of warmed cooling air from the information handlingsystem rack to recycle back into the connection plenum to mix withincoming cooling air.

In at least one embodiment, consumption of cooling air may be reduced orminimized. Such an embodiment may, for example, lower running costs ofdata centers and/or reduce energy consumption.

In at least one embodiment, total flow of cooling air for a rack may bereduced. This may in turn lower running costs and/or reduce energyconsumption.

In at least one embodiment, effective cooling with a low cost and withrelatively low construction costs may be achieved. Such an embodimentmay enable financial savings. In at least one embodiment, specificvolumetric quantities of air may be distributed to a rack, which may inturn lower running costs and/or reduce energy consumption.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of the present embodiments and advantagesthereof may be acquired by referring, by way of example, to thefollowing description taken in conjunction with the accompanyingdrawings, in which like reference numbers indicate like features, andwherein:

FIGS. 1 and 2 illustrate two example embodiments of a system for coolingan information handling system rack (e.g., a server rack), according tocertain embodiments of the present disclosure;

FIG. 3 illustrates an example configuration for controlling ventilatorsof the cooling system of FIGS. 1 or 2, according to certain embodimentsof the present disclosure; and

FIG. 4 illustrates a flow chart of an example method for controlling thetemperature of an information handling system rack, in accordance withan embodiment of the present disclosure.

DETAILED DESCRIPTION

Preferred embodiments and their advantages are best understood byreference to FIGS. 1 to 4, wherein like numbers are used to indicatelike and corresponding parts.

For the purposes of this disclosure, an information handling system mayinclude any instrumentality or aggregate of instrumentalities operableto compute, classify, process, transmit, receive, retrieve, originate,switch, store, display, manifest, detect, record, reproduce, handle, orutilize any form of information, intelligence, or data for business,scientific, control, entertainment, or other purposes. For example, aninformation handling system may be a personal computer, a PDA, aconsumer electronic device, a network storage device, or any othersuitable device and may vary in size, shape, performance, functionality,and price. The information handling system may include memory, one ormore processing resources such as a central processing unit (CPU) orhardware or software control logic. Additional components or theinformation handling system may include one or more storage devices, oneor more communications ports for communicating with external devices aswell as various input and output (I/O) devices, such as a keyboard, amouse, and a video display. The information handling system may alsoinclude one or more buses operable to transmit communication between thevarious hardware components.

FIGS. 1 and 2 illustrate two example embodiments of a system for coolingan information handling system rack (e.g., a server rack), according tocertain embodiments of the present disclosure. The example embodimentsin FIG. 1 and 2 generally resemble each other and have similar technicalfeatures. The main difference is that cooling air is supplied from belowin the embodiment illustrated by FIG. 1, while cooling air is suppliedfrom above in the embodiment illustrated by FIG. 2. Like referencenumbers are used to indicate like and corresponding parts in FIGS. 1 and2.

FIG. 1 illustrates an example embodiment of a system 100A, for examplean information handling system in the form of a rack 170 (e.g., a serverrack). A data center may for example include one or more such systems100A. The system 100A may include a top side 110, a front side 112, abottom side 114, and a rear side 116. Further, the system may include afront rack side 118, a back rack side 120, and a connecting rack side122.

The front rack side 118, the back rack side 120, the top side 110, andthe connecting rack side 122 may be connected to each other and form arack 170 for one or more rack units 140. The top side 110, the frontside 112, the bottom side 114, and the rear side 116 may be connected toeach other and form the outer sides of the system 100A.

A front plenum 130 may be formed between the front side 112 and thefront rack side 118. The front plenum 130 may be configured to transportair throughout the entire height of the rack 170. A back plenum 132 maybe formed between the back side 116 and the back rack side 120. The backplenum 132 may be configured to transport air throughout the entireheight of the rack 170. A connecting plenum 134 may be formed betweenthe connecting rack side 122 and the bottom side 114. The connectingplenum 134 may connect the front plenum 130 and the back plenum 132, forexample at 90 degree connections, and may be configured to transport airfrom the back plenum 132 to the front plenum 130. In the specificexample illustrated by FIG. 1, the connecting plenum 134 is located atthe bottom of the system 100A.

FIG. 1 illustrates six rack units 140 within the rack 170 as an example,but any suitable numbers of rack units may be placed in the rack 170.The rack units 140 may or may not include sensors 152, e.g., temperaturesensors. One or more sensors may be placed within a rack unit 140, suchas for example a temperature sensor 152 included in the rack unit 140for sensing the temperature of components within the rack unit 140. Asensor dedicated to the rack unit 140 may indicate air temperature ofthe air flow through the rack 170.

The front rack side 118, the back rack side 120, and the connecting rackside 122 may allow air to pass through them, for example by includingone or more openings allowing air flow, e.g., as shown in FIG. 1.Similarly, the bottom side 114 and the rear side 116 may allow air topass through them, for example by including one or more openingsallowing air flow, e.g., as shown in FIG. 1. Thus, cool air for coolingthe rack 170 may enter through the bottom side 114 into the connectingplenum 134. From the connecting plenum 134 the air may move to the frontplenum 130 and continue into the rack 170, as indicated by arrows inFIG. 1. From the connecting plenum 134 the air may also move directlyinto the rack 170 via openings in the connecting rack side 122, asindicated by arrows in FIG. 1. The cooling air cools the rack 170 andits rack units 140. The air flowing through rack 170 may be heated bywarm rack units 140 and the heated air may move into the back plenum 132and out from the rack 170 through openings in rear side 116 into thespace surrounding the system 100A, as indicated by arrows in FIG. 1.

One or more ventilators 160, 162, 164 may be used for moving air to theconnecting plenum 134. In one embodiment, a ventilator 160 may belocated on the inside of the system 100A, for example inside theconnecting plenum 134. The ventilator 160 may move air from outside thesystem 100A in to the connecting plenum 134. Alternatively, oradditionally, a ventilator 162 may be located on the outside of thesystem 100A for moving air from outside the system 100A in to theconnecting plenum 134. Alternatively, or additionally, a ventilator 164may be located in the air flow between the back plenum 132 and theconnecting plenum 134 for moving air from the back plenum 132 into theconnecting plenum 134. In this manner, warmer air may be moved into theconnecting plenum 134 and mixed with the cooling air for the rack 170.This may reduce the amount of cool air used for cooling the rack 170.

The one or more ventilators 160, 162, 164 may include, e.g., poweredfans, actuated vents, a combination of both, or any other device forgenerating or promoting an air flow. In the case of a powered fan, thelevel of air flow generated by the fan may be controlled by controllingthe rotational speed of the fan. Tables may indicate the amount of airmoved by a fan at a specific rotational speed. In the case of anactuated vent, the air flow may be regulated by incrementally openingand closing the vent by an actuator. To ensure that the air flows in theright direction, the vents may be configured to only allow air to passthrough in one direction, for example from the back plenum 132 to theconnecting plenum 134.

Sensors 150, 152, 154, 156 may be provided for sensing the temperatureof the air within the system 100A. These sensors may be one or morediscrete rack sensors 150, 154, 156, or one or more sensors 152 of arack unit 140 disposed in the rack 170, or a combination of both. Thesensors may indicate the temperature of the air flow within differentparts of the system 100A.

The temperature of the air flowing into the rack 170, namely thetemperature of the air flow in the front plenum 130, may representimportant control data. Thus, at least one sensor 150 may be placedwithin the front plenum 130. The location of the sensor 150 illustratedin FIG. 1 is only an example and any suitable location within the frontplenum 130 may be used.

The temperature of the cool air that flows into the connecting plenum134 may also represent important control data. Thus, at least one sensor156 may be placed within the connecting plenum 134. The location of thesensor 156 illustrated in FIG. 1 is only an example and any suitablelocation within the connecting plenum 134 may be used.

The temperature of the air that flows out of the rack 170 or within theback plenum 133 may also represent important control data because thisair flow is mixed with the cooling air flow in the connecting plenum134. Thus, the temperatures of the two air flows mixing in theconnecting plenum may be determined. Thus, at least one sensor 154 maybe placed within the connecting plenum 134 or the back plenum 132. Thelocation of the sensor 154 illustrated in FIG. 1 is only an example andany suitable location within the connecting plenum 134 or back plenum132 may be used.

The system 100A may further include guide element 126, for example aturning vane or other structure, for guiding air from the back plenum132 into the connecting plenum 134. The guide element 126 may beconfigured to separate, in the vicinity of at least one of the sensors154, 156, warmer air from the back plenum 132 from cooler air enteringthe connecting plenum 134 from outside the rack 170. In this way thetemperature sensor 154 may accurately measure the temperature of the airflow moved by the ventilator 164, and the temperature sensor 156 mayaccurately measure the temperature of the incoming cooling air, withoutcross-interference between the two air flow. In other words, the warmerair measurement is separated from the cool air measurement. The exampleguide element 126 in FIG. 1 is L-shaped. However, this is only oneexample; any suitable shape (e.g., planar, curved, etc.) and/ororientation of a guide element for guiding the air flow in theconnecting plenum 134 may be used.

The system 100A may be placed in any suitable space, such as for examplea computer center, room, or similar. The space may be equipped with araised floor 104 with vent tiles 102 configured to provide cool air toinformation handling systems, such as racks 170, from a pressurizedplenum 138 in the space below the raised floor 104.

In embodiments in which the connecting plenum 134 is a lower plenum(e.g., the embodiment of FIG. 1), the system 100A may be connectable toa floor plenum 138 with cool air by means of a skirt 124. The skirt 124may include rubber, brushes, or any other suitable material for guidingthe cool air from the floor plenum 138 to the lower plenum 134.Preferably, the skirt 124 may be of a compliant material for racktransport.

In one embodiment, the front side 112 may be, or may include, a frontdoor. The front door 112 may be solid and include a front access panel128 configured to allow at least partial access to the rack 170. Theaccess panel 128 may for example be a sliding or hinged door thatsubstantially preserves the integrity of the front plenum 130 when thefront door 112 is closed, to reduce or minimize any disturbances to theinternal air flow of the system 100A, which may reduce the necessaryamount of cool air for cooling the rack.

FIG. 2 illustrates another example system 100B, in accordance withcertain embodiments of the present disclosure. System 100B resemblessystem 100A of FIG. 1, except in system 100A the cool air for coolingthe rack is supplied from the floor, while in system 100B the cool airis supplied from above, e.g., from the ceiling. Like reference numbersare used to indicate like and corresponding parts between the exampleembodiments shown in FIGS. 1 and 2.

The front rack side 118, the back rack side 120, and the connecting rackside 122 may allow air to pass through, e.g., by including one or moreopenings. The top side 110 and the rear side 116 may also allow air topass through, e.g., by including one or more openings. Thus, cool airfor cooling the rack 170 may enter through the top side 110 into theconnecting plenum 134, as indicated by arrows in FIG. 2. From theconnecting plenum 134 the air may move to the front plenum 130 andcontinue into the rack 170, as indicated by arrows in FIG. 2. From theconnecting plenum 134 the air may also move directly into the rack 170via the connecting rack side 122, as indicated by an arrow in FIG. 2.The cooling air cools the rack 170 and its units 140. The air passingthrough rack 170 may be heated by warm rack units 140 and the heated airmay move into the back plenum 132 and out from the rack 170 throughopenings in read side 116, as indicated by arrows in FIG. 2.

The space in which the system 100B may be placed may be equipped with anoverhead cool air supply system. Such a system may include, e.g., aceiling plenum with vent 102 configured to provide cool air toinformation handling systems, such as racks 170.

In embodiments in which the connecting plenum 134 is an upper plenum,e.g., as illustrated in FIG. 2, the system 100B may be connectable to aceiling plenum 138 providing cool air. Depending on the existing ceilingplenum, this connection may be facilitated by means of a skirt 124. Theskirt 124 may include rubber, brushes, or any other suitable materialfor guiding the cool air from the ceiling plenum 138 to the upper plenum134.

Further, the shape and/or orientation of the guide element 126 in FIG. 2for guiding air from the back plenum 132 into the connecting plenum 134may differ from the shape and/or orientation of the guide element 126 inFIG. 1. For example, the guide element 126 shown in FIG. 2 is L-shaped,but arranged in a different orientation than the guide element 126 inthe embodiment of FIG. 1. However, this is only one example; anysuitable shape (e.g., planar, curved, etc.) and/or orientation a guideelement for guiding the air flow in the connecting plenum 134 may beused.

The guide element 126 may be configured to separate, in the vicinity ofat least one of the sensors 154, 156, warmer air from the back plenum132 from cooler air entering the connecting plenum 134 from outside therack 170. In this way the temperature sensor 154 may accurately measurethe temperature of the air flow moved by the ventilator 164, and thetemperature sensor 156 may accurately measure the temperature of theincoming cooling air, without cross-interference between the two airflow. In other words, the warmer air measurement is separated from thecool air measurement.

According to other embodiments, the space in which system 100 is placedmay be an air-conditioned room. In such embodiments, cool air may not besupplied from specific plenums from above or below; instead, cool airsurrounds the system 100 and may for example enter the system 100through the aid of ventilators 160 or 162. Cool air may enter theconnecting plenum 134 and, depending on the sensed temperature, theheated air by the rack 170 may be mixed with the cool air.

FIG. 3 illustrates an example configuration for controlling ventilatorsaccording to certain embodiments of the present disclosure, which may,for example, be used in connection with any of the embodiments shown inFIGS. 1 or 2. At least one of the sensors 150, 152, 154, 156 may beconnected to a controller 200, which in may be is connected to at leastone ventilator 160, 164. As disclosed above, the rack 170 may includeone or more sensors 152 within each rack unit 140.

The temperature readings of the sensors 150, 152, 154, 156 may beprocessed by the controller 200 to control the at least one ventilator160, 162, 164. For example, in the case of a fan, the controller 200 mayincrease, decrease or stop the fan based on the temperature readings. Asanother example, in the case of an actuated vent, the controller 200 mayopen or close the vent fully or partially.

According to some embodiments, a front plenum extension is added to anotherwise standard rack. The front plenum is configured to a depthcapable of transporting air throughout the entire height of the rack.The extended front door may be solid such that air delivered to the racktravels vertically, parallel to the front door. Vent tiles may be placedbelow the rack such that the entire underside of the rack acceptscooling air from a raised floor plenum. A connecting rack plenum may beformed, likely to decrease the useable rack space. The connecting plenummay deliver air to the front plenum.

The connecting plenum (lower plenum) may be fairly tightly coupled tothe raised floor by an extension, a skirt, of the rack extending to thefloor (in the area of the casters). This skirt may include a compliantmaterial for transport. Material examples may include brush or rubberwhere the material is reasonably impervious to air but compliant enoughfor rack transport.

At least one mixing ventilator, such as for example a fan, may be addedto the rear of the rack. In operation, the effect of the mixingventilator is to inject warm IT exhaust into the connecting plenum.Mixed with the cool air from the raised floor, this controlled injectionof warm air enables a targeted delivery temperature for the frontplenum. A control mechanism adjusts the ventilators based on an inlettemperature sensor or average of several sensors. The sensors may bediscrete rack sensors or sensors built into a specified server(s).

FIG. 4 illustrates a flow chart of an example method 300 for controllingthe temperature of a rack, in accordance with the present disclosure.The method may implemented, for example, by systems 100A and/or 100Bdescribed above.

At step 302, the system 100 (e.g., system 100A and/or 100B) may initiatecontrol of the temperature in the rack 170. A target temperature or atarget temperature band is set, for example as a default value or by auser of the system. The target temperature set may for example be 25degrees Celsius or any other temperature suitable for assuring properworking of the electronic components in the rack 170. The targettemperature band may for example be 24 to 26 degrees Celsius or anyother temperature band suitable for assuring proper working of theelectronic components in the rack 170. A default value of 25 degreesCelsius may be used.

At step 304, one or more sensors 150, 152, 154, 156 may take one or moretemperature measurements and communicate such temperature measurementsto controller 200.

At step 306, controller 200 may compare the sensed temperatures fromsensors 152 with the target temperature or the target temperature band,and in response, control ventilators 160, 162, 164 accordingly. Forexample, controller 200 may control ventilators 160, 162, 164 in orderto control (a) the amount of cool air delivered to the system 100 and/or(b) the mixture of warmer air (e.g., air flow that has passed throughthe rack and/or air flow from outside the rack) with cooling air in theconnecting plenum 134.

If the temperature sensors 150, 152, 154, 156 register a temperaturegreater than the target temperature or target temperature band,controller 200 may control ventilators 160, 162, 164 to increase coolingin the rack 170. For example, controller 200 may control one or moreventilators that provide cool air to the system 100 to increase theamount of cool air delivered into the system, e.g., by turning on orspeeding up one or more cool air fans (e.g., ventilator 160 shown inFIG. 1). In addition or alternatively, controller 200 may control one ormore ventilators 160, 162, 164 in order to decrease or completely shutoff the amount of warmer air (e.g., air flow that has passed through therack and/or air flow from outside the rack) that enters into theconnecting plenum 134 to mix with the cooler air. As one example,controller 200 may turn off or reduce the speed of one or more fans thatrecycle warmer air into the connecting plenum 134 (e.g., ventilator 164shown in FIG. 1). As another example, controller 200 may fully orpartially close one or more actuated vents that allows warmer air (e.g.,air flow that has passed through the rack and/or air flow from outsidethe rack) to mix with the cooling air in connecting plenum 134.

Alternatively, if the temperature sensors 150, 152, 154, 156 register atemperature lower than the target temperature or target temperatureband, controller 200 may control ventilators 160, 162, 164 to decreasecooling in the rack 170. For example, controller 200 may control one ormore ventilators that provide cool air to the system 100 to decrease theamount of cool air delivered into the system, e.g., by turning off orslowing down one or more cool air fans (e.g., ventilator 160 shown inFIG. 1). In addition or alternatively, controller 200 may control one ormore ventilators 160, 162, 164 in order to increase the amount of warmerair (e.g., air flow that has passed through the rack and/or air flowfrom outside the rack) that enters into the connecting plenum 134 to mixwith the cooler air. As one example, controller 200 may turn on orincrease the speed of one or more fans that recycle warmer air into theconnecting plenum 134 (e.g., ventilator 164 shown in FIG. 1). As anotherexample, controller 200 may fully or partially open one or more actuatedvents that allows warmer air (e.g., air flow that has passed through therack and/or air flow from outside the rack) to mix with the cooling airin connecting plenum 134.

In some embodiments, controller 200 may use an averaged temperaturemeasurement from one or more sensors 150, 152, 154, 156. The sensedtemperature used in the method may be an average temperature of severalsensors. An average of the temperature may also be established with aplurality of measurements (from one or multiple sensors) averaged overtime. The average temperature may be fully or partly derived fromsensors 152 of rack units within the rack, or from discrete rack sensors150, 154, 156, or a combination of both.

At step 308, a new target temperature or target temperature band may ormay not be set (e.g., by controller 200 or by a user). The method maythen return to step 304.

Controller 200 may continue to analyze the temperature measurements andadjust the ventilators 160, 162, 164 to meet and maintain the prescribedtemperature or temperature band. In other words, steps 304-308 may berepeated as long as desired.

The method for controlling the temperature within the rack 170 may beused to estimate flow rates within the system 100. Flow rates may beestimated within the system 100 by assuming that the cooling air flowinto the connecting plenum 134 is the same as the air flow leaving thesystem. Such estimation is further described below.

The method for controlling the temperature within the rack 170 may alsobe used to estimate savings made by using less cool air than a similarrack without the disclosed system 100 or compared with other systems.Saved cool air consumption may be estimated as the air moved by the atleast one ventilator 160, 162, 164. Thus, a value can be establishedthat quantifies one benefit of the disclosed system 100.

Turning to the estimations of air flow that can be made in certainembodiments of the present disclosure, the following further disclosureis made for a better understanding of such estimations. The followingvariables may be assumed:

-   -   Ti=Temperature of air in the front plenum 130;    -   Tf=Temperature of cool air to the connecting plenum 134;    -   Tm=Temperature of warm air to the connecting plenum 134 to be        mixed with the cooling air;    -   Fi=Air flow in the front plenum 130;    -   Fm=Air flow through the at least one ventilator 160, 162, 164;    -   Fr=Air flow through the rack 170;    -   A %=percentage of cool air flow to the connecting plenum 134;        and    -   B %=percentage of warm air flow to the connecting plenum 134.

Air flow through one or more fans (e.g., 160, 162, 164) may be derivedfrom tables indicating the air flow (Fm) based on the rotational speedof the fan(s). Assume further that the cooling air flow into theconnecting plenum 134 is the same as the air flow leaving the system 100and that saved air consumption is the same as the air moved by the oneor more fans. Further, the following may be assumed for the system 100:

Tf*A %+Tm*B %=Ti

A %+B %=100%

Fi and Fr may then be calculated:

Tf*(100%−B %)+Tm*B %=Ti

B %=(Ti−Tf)/(Tm−Tf)

B%=Fm/Fi

Fi=Fm(looked up in table)/B %

Fr=Fi−Fm

With the disclosed systems and methods, Fi and Fr may be calculated orestimated. The amount of air consumption (Fm) saved for the rack usingthe systems and method disclosed herein can consequently be looked upbased on the rotational speed of the fan(s) (rotations per minute, RPM).The amount of air consumed by the rack may be estimated as Fi.

In operation for a specific embodiment, the approximate flow expressedin percent (based on the total flow rate of the rack in the specificembodiment) required to achieve a mixed temperature of 75 Fahrenheit ina rack full of information handling systems based on the cooling airtemperature (Tf) delivered to the connecting plenum and the temperaturerise in the rack (dT), may be illustrated by the following table. Valuesof dT are listed in bold in the top row, values of Tf are listed in boldin the first column, and values of the percent of cooling air requiredto achieve a mixed temperature of 75 Fahrenheit in a rack full ofinformation handling systems based on the cooling air temperature (Tf)delivered to the connecting plenum and the temperature rise in the rack(dT) are listed in the corresponding boxes.

20 dT 25 dT 30 dT 35 dT 40 dT 55 Tf 50% 56% 60% 64% 66% 57 Tf 53% 58%63% 66% 69% 59 Tf 56% 61% 65% 69% 71% 61 Tf 59% 64% 68% 71% 74% 63 Tf63% 68% 71% 74% 77% 65 Tf 67% 71% 75% 78% 80%

The table may thus indicate the required flow for maintaining a specifictemperature within a rack. For example, when supplying cool air to theconnecting plenum at the temperature of 59 F and the rack temperaturerise by 25 F, a flow of 61% of the total flow rate of the rack may benecessary to maintain 75 F in the rack.

Although the present disclosure has been described in detail, it shouldbe understood that various changes, substitutions, and alterations canbe made hereto without departing from the spirit and the scope of thedisclosure as defined by the appended claims.

1. A system for controlling the temperature of a rack, comprising: aconnecting plenum configured to receive incoming cooling air fromoutside a rack for cooling the rack; a front plenum connected to theconnecting plenum and configured to receive cooling air from theconnecting plenum and deliver the cooling air to the rack, the coolingair being warmed by powered electrical components as it passes throughthe rack; at least one ventilator for recycling warmed cooling air fromthe rack back to the connecting plenum to be mixed with incoming coolingair; at least one temperature sensor for sensing air temperature in thesystem; and a controller for controlling the at least one ventilatorbased at least on the sensed air temperature.
 2. A system according toclaim 1, further comprising a back plenum configured to transport atleast a portion of the warmed cooling air exiting the rack back towardthe connecting plenum.
 3. A system according to claim 2, furthercomprising a guide element for guiding warmed cooling air from the backplenum to the connecting plenum, the guide element being configured forseparating, in the vicinity of a particular temperature sensor, warmedcooling air from the back plenum from incoming cooling air entering theconnecting plenum from outside the rack.
 4. A system according to claim2, wherein the at least one ventilator includes a fan configured to moveair from the back plenum to the connecting plenum.
 5. A system accordingto claim 2, wherein the at least one ventilator includes an actuatedvent for controlling the flow of warmed cooling air from the back plenumto the connecting plenum.
 6. A system according to claim 1, furthercomprising a solid front door comprising a front access panel configuredto allow at least partial access to the rack.
 7. A system according toclaim 1, wherein the at least one temperature sensor includes atemperature sensor associated with a rack unit disposed in the rack. 8.A system according to claim 1, wherein the connecting plenum is a lowerplenum connectable to a floor plenum such that the connecting plenum canreceive cooling air from the floor plenum.
 9. A system according toclaim 1, wherein the connecting plenum is an upper plenum connectable toa ceiling plenum such that the connecting plenum can receive cooling airfrom the ceiling plenum.
 10. A system according to claim 1, wherein theconnecting plenum is configured to receive cooling air from anair-conditioned room in which the system is located.
 11. A systemaccording to claim 1, wherein the at least one temperature sensorcomprises a first temperature sensor located for sensing the temperatureof the incoming cooling air and a second temperature sensor located forsensing the warmed cooling air moved by the at least one ventilator. 12.A system, comprising: a rack; a plurality of information handlingsystems disposed in the rack; and a temperature control system forcontrolling the temperature of the rack, comprising: a connecting plenumconfigured to receive incoming cooling air from outside a rack forcooling the rack; a front plenum connected to the connecting plenum andconfigured to receive cooling air from the connecting plenum and deliverthe cooling air to the rack, the cooling air being warmed by poweredelectrical components as it passes through the rack; a back plenumconfigured to received warmed cooling air from the rack; at least onecontrollable ventilator for recycling warmed cooling air from the backplenum to the connecting plenum to be mixed with incoming cooling air;at least one temperature sensor for sensing air temperature in thesystem; and a controller for controlling the at least one ventilatorbased at least on the sensed air temperature.
 13. A system according toclaim 12, further comprising a guide element for guiding warmed coolingair from the back plenum to the connecting plenum, the guide elementbeing configured for separating, in the vicinity of a particulartemperature sensor, warmed cooling air from the back plenum fromincoming cooling air entering the connecting plenum from outside therack.
 14. A system according to claim 12, wherein the at least oneventilator includes a fan configured to move air from the back plenum tothe connecting plenum.
 15. A system according to claim 12, wherein theat least one ventilator includes an actuated vent for controlling theflow of warmed cooling air from the back plenum to the connectingplenum.
 16. A system according to claim 12, wherein the connectingplenum is a lower plenum connectable to a floor plenum such that theconnecting plenum can receive cooling air from the floor plenum.
 17. Asystem according to claim 12, wherein the connecting plenum is an upperplenum connectable to a ceiling plenum such that the connecting plenumcan receive cooling air from the ceiling plenum.
 18. A method forcontrolling a cooling system configured to control the temperature of aninformation handling system rack, the method comprising: setting atarget temperature or a target temperature band for an informationhandling system rack; operating a cooling system such that cooling airis received from outside the cooling system into a connection plenum,flows from the connection plenum to a delivery plenum, and flows fromthe delivery plenum through the information handling system rack, thecooling air being warmed by electrical components as the cooling airflows through the information handling system rack; taking one or moreair temperature measurements; and based on the one or more airtemperature measurements, controlling one or more ventilators to controlan amount of warmed cooling air from the information handling systemrack to recycle back into the connection plenum to mix with incomingcooling air.
 19. A method according to claim 18, wherein controlling oneor more ventilators comprises controlling a speed of one or more fans.20. A method according to claim 18, wherein controlling one or moreventilators comprises opening or closing one or more vents.
 21. A systemfor controlling the temperature of a rack, comprising: a first plenumconfigured to receive incoming cooling air from outside a rack forcooling the rack; a front plenum connected to the first plenum andconfigured to receive cooling air from the first plenum and deliver thecooling air to the rack, the cooling air being warmed by poweredelectrical components as it passes through the rack; and a back plenumconfigured to received warmed cooling air from the rack and deliver thecooling air to outside the rack.
 22. A system according to claim 21,further comprising an element configured for separating warmed coolingair from the back plenum from incoming cooling air entering the firstplenum from outside the rack.
 23. A system according to claim 21,further comprising a solid front door comprising a front access panelconfigured to allow at least partial access to the rack.
 24. A systemaccording to claim 21, wherein the first plenum is a lower plenumconnectable to a floor plenum such that the first plenum can receivecooling air from the floor plenum.
 25. A system according to claim 21,wherein the first plenum is an upper plenum connectable to a ceilingplenum such that the first plenum can receive cooling air from theceiling plenum.
 26. A system according to claim 21, wherein the firstplenum is configured to receive cooling air from an air-conditioned roomin which the system is located.
 27. A system according to claim 21,wherein the back plenum connected to the outside of the rack via aperforated enclosure.
 28. A system, comprising: a rack; a plurality ofinformation handling systems disposed in the rack; and a cooling systemfor controlling the temperature of the rack, comprising: a first plenumconfigured to receive incoming cooling air from outside a rack forcooling the rack; a front plenum connected to the first plenum andconfigured to receive cooling air from the first plenum and deliver thecooling air to the rack, the cooling air being warmed by poweredelectrical components as it passes through the rack; and a back plenumconfigured to received warmed cooling air from the rack and deliver thecooling air to outside the rack.
 29. A system according to claim 28,further comprising an element configured for separating warmed coolingair from the back plenum from incoming cooling air entering the firstplenum from outside the rack.
 30. A system according to claim 28,further comprising a solid front door comprising a front access panelconfigured to allow at least partial access to the rack.
 31. A systemaccording to claim 28, wherein the first plenum is a lower plenumconnectable to a floor plenum such that the first plenum can receivecooling air from the floor plenum.
 32. A system according to claim 28,wherein the first plenum is an upper plenum connectable to a ceilingplenum such that the first plenum can receive cooling air from theceiling plenum.
 33. A system according to claim 28, wherein the firstplenum is configured to receive cooling air from an air-conditioned roomin which the system is located.
 34. A system according to claim 28,wherein the back plenum connected to the outside of the rack via aperforated enclosure.
 35. A method for controlling the temperature of arack, comprising: receiving, at a first plenum, incoming cooling airfrom outside a rack for cooling the rack; receiving, at a front plenumconnected to the first plenum, cooling air from the first plenum;delivering, by the front plenum, the cooling air to the rack such thatthe cooling air is warmed by powered electrical components as it passesthrough the rack; receiving, at a back plenum, warmed cooling air fromthe rack; and delivering, by the back plenum, warmed cooling air fromthe rack to outside the rack.
 36. A method according to claim 36,further comprising separating warmed cooling air from the back plenumfrom incoming cooling air entering the first plenum from outside therack.